✦ LIBER ✦
VLSI chip interconnection technology using stacked solder bumps : Norio Matsui, Shinichi Sasaki and Takaaki Ohsaki. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-12, 566 (1987)
- Book ID
- 103287131
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 136 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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