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Viscoelasticity of epoxy resin/silica hybrid materials with an acid anhydride curing agent

✍ Scribed by Wakako Araki; Shogo Wada; Tadaharu Adachi

Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
277 KB
Volume
108
Category
Article
ISSN
0021-8995

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Thermal scanning rheometric analysis of
Thermal scanning rheometric analysis of curing kinetic of an epoxy resin. I. An anhydride as curing agent
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The curing reaction of the system diglycidyl ether of bisphenol A (DGEBA), an organic anhydride (HMTPA), as curing agent and a tertiary amine (DMP 30) as initiator has been studied by Thermal Scanning Rheometry (TSR) under isothermal conditions. The gel time, which is defined by several different cr