Vibration analysis of adhesively bonded lap joint, part II: Numerical solution
โ Scribed by M.D. Rao; S. He
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 556 KB
- Volume
- 152
- Category
- Article
- ISSN
- 0022-460X
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๐ SIMILAR VOLUMES
An isoparametric adhesive interface element is used in the vibration analysis of adhesively bonded structures. It is assumed that transverse shear and peel stresses prevail in the adhesive layer. The analyses articulate separate responses of the upper and lower adherends and the adhesive. The natura
Based on a waveguide model presented in a companion paper (L. Kari 2001 Journal of Sound and <ibration 244, 211}233 [1]), the in#uences of higher order modes and structure-borne sound dispersion on the axial dynamic sti!ness for cylindrical vibration isolators are investigated. On the whole, a moder