Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route

✍ Scribed by D. De Roest; Y. Travaly; J. Beynet; H. Sprey; J. Labat; C. Huffman; P. Verdonck; S. Kaneko; K. Matsushita; N. Kobayashi; G. Beyer

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 533 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.06.036