✦ LIBER ✦
UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process
✍ Scribed by Lee, Seung-Woo; Park, Ji-Won; Park, Cho-Hee; Lim, Dong-Hyuk; Kim, Hyun-Joong; Song, Jun-Yeob; Lee, Jae-Hak
- Book ID
- 121001544
- Publisher
- Elsevier Science
- Year
- 2013
- Tongue
- English
- Weight
- 875 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0143-7496
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