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Using Single-Wall Carbon Nanotubes and Raman Spectroscopy to Measure Local Stresses in First-Level Flip-Chip Organic Packages

✍ Scribed by Nnebe, I.; Soojae Park; Feger, C.


Book ID
119815844
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
591 KB
Volume
1
Category
Article
ISSN
2156-3950

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