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Using self-assembled monolayers for controlled electrodeposition of copper into submicrometer size surface features/decrements

✍ Scribed by Mikołaj Donten; Mateusz L. Donten; Zbigniew Stojek; Kazimierz Wikiel


Book ID
106243666
Publisher
Springer
Year
2006
Tongue
English
Weight
282 KB
Volume
10
Category
Article
ISSN
1432-8488

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