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Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy

✍ Scribed by W. Yang; F. Liu; Z. F. Xu; B. P. Lu; G. C. Yang

Publisher: Springer
Year: 2010
Tongue: English
Weight: 630 KB
Volume: 46
Category: Article
ISSN: 0022-2461
DOI: 10.1007/s10853-010-5189-6

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