Formation of metal wire arrays via elect
✍
Fang, C. ;Foca, E. ;Sirbu, L. ;Carstensen, J. ;Föll, H. ;Tiginyanu, I. M.
📂
Article
📅
2007
🏛
John Wiley and Sons
🌐
English
⚖ 855 KB
## Abstract Deep straight macropores in n‐type Si have been completely filled with copper (Cu). Homogeneous metal deposition inside the deep pores was achieved by means of electroplating using a solution containing only CuSO~4~ mixed with H~2~SO~4~ and an optimized process that begins at the bottom