𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Uniaxial and biaxial fracture behaviour of refractory materials

✍ Scribed by E.K. Tschegg; K.T. Fendt; Ch. Manhart; H. Harmuth


Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
705 KB
Volume
76
Category
Article
ISSN
0013-7944

No coin nor oath required. For personal study only.

✦ Synopsis


Mechanical fracture properties of specimens taken from refractory materials of different brittleness are described using the wedge splitting method according to Tschegg in uniaxial and biaxial load cases. Notch-tensile strength, fracture energy and the characteristic length were determined. Fracture energy under a uniaxial load is more or less the same for all materials; if a load becomes biaxial, values fall to approx. 70% in materials with reduced brittleness and to 40% in brittle materials, compared to uniaxial values. The sensitivity against crack propagation (l ch ) changes insignificantly under both uniaxial and biaxial loading of brittle and brittleness-reduced materials.


πŸ“œ SIMILAR VOLUMES


Statistics of fracture of ATJ-S graphite
✍ J Jortner πŸ“‚ Article πŸ“… 1975 πŸ› Elsevier Science 🌐 English βš– 133 KB

graphite were tested at room temperature. The ratio of bend strength to tensile strength was close to that predicted by the Weibull theory of strength, but the effect of sample volume was much less than predicted by Weibull theory. appear to be responsible for the acidity found on the surface of thi

Mechanical and fracture behaviour of por
✍ Ph. Bompard; Dan Wei; T. Guennouni; D. FranΓ§ois πŸ“‚ Article πŸ“… 1987 πŸ› Elsevier Science 🌐 English βš– 953 KB

The elastic moduli of porous materials represented as a combination of spherical, cylindrical or disk shaped holes or solid elements was calculated using a self consistent method. A yield criterion could be found by stating that the elastic distortion energy evaluated with these moduli was equal to

Biaxial Fracture Test of Silicon Wafers
✍ C. Funke; E. Kullig; M. Kuna; H.J. MΓΆller πŸ“‚ Article πŸ“… 2004 πŸ› John Wiley and Sons 🌐 English βš– 203 KB

The statistical fracture stress distribution of silicon wafers was obtained by biaxial plate bending tests in combination with finite element calculations. For the correct interpretation of these tests it is important that the finite element calculations imply wafer thickness and elastic properties