Uneven curing induced interfacial delamination of UV adhesive-bonded fiber array in V-groove for photonic packaging

✍ Scribed by Uddin, M.A.; Hau Ping Chan; Tsun, T.O.; Chan, Y.C.

• Book ID: 115371761
• Publisher: Optical Society of America
• Year: 2006
• Tongue: English
• Weight: 866 KB
• Volume: 24
• Category: Article
• ISSN: 0733-8724
• DOI: 10.1109/JLT.2005.863329