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Ultrasonic Wave Scattering by a Line Crack in a Solder Joint

โœ Scribed by P. Dineva; D. Gross; T. Rangelov


Book ID
105742602
Publisher
Springer
Year
1999
Tongue
English
Weight
345 KB
Volume
11
Category
Article
ISSN
0934-9847

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๐Ÿ“œ SIMILAR VOLUMES


EVALUATION OF SCATTERED WAVE AND STRESS
โœ P. Dineva; D. Gross; T. Rangelov ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 232 KB

Two dierent, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration ยฎeld in the thin base layer of a damaged solder joint is the ยฎrst one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly d