EVALUATION OF SCATTERED WAVE AND STRESS
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P. Dineva; D. Gross; T. Rangelov
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Article
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1999
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Elsevier Science
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English
โ 232 KB
Two dierent, but equally important problems for solder joint reliability are solved. The evaluation of the dynamic stress concentration ยฎeld in the thin base layer of a damaged solder joint is the ยฎrst one. It is considered as a rectangular plate with a central macro-crack surrounded with randomly d