Ultrasonic Velocity Technique for Nondestructive Quantification of Elastic Moduli Degradation during Creep in Silicon Nitride

✍ Scribed by František Lofaj; Gerald V. Blessing; Sheldon M. Wiederhorn

• Book ID: 108575567
• Publisher: John Wiley and Sons
• Year: 2003
• Tongue: English
• Weight: 474 KB
• Volume: 86
• Category: Article
• ISSN: 0002-7820
• DOI: 10.1111/j.1151-2916.2003.tb03381.x