Ultramorphological analysis of resin-dentin interfaces produced with water-based single-step and two-step adhesives: Nanoleakage expression
✍ Scribed by Reis, Andr� F. ;Arrais, Cesar A.G. ;Novaes, Pedro D. ;Carvalho, Ricardo M. ;De Goes, M�rio F. ;Giannini, Marcelo
- Book ID
- 102298333
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 340 KB
- Volume
- 71B
- Category
- Article
- ISSN
- 0021-9304
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✦ Synopsis
Abstract
This study evaluated the nanoleakage patterns in bonded interfaces using two single‐step, self‐etching adhesives (Adper Prompt—AD, and One‐up Bond F—OB), two two‐step, self‐etching primers (Clearfil SE Bond—CF, and Unifil Bond—UB), and one two‐step, total‐etch adhesive (Single Bond—SB). Dentin surfaces were bonded with the adhesive systems and stored in water at 37°C for 1 week and 6 months. After storage periods, teeth were sectioned into 0.8 mm‐thick slabs, coated with nail varnish except for the bonded interfaces, and immersed in ammoniacal AgNO~3~ for 24 h. After immersion in photodeveloping solution, bonded sections were prepared and observed under a SEM using the backscattered electron mode. Undemineralized, unstained, epoxy resin‐embedded sections were prepared for TEM. Nanoleakage patterns were qualitatively compared between periods. Nanoleakage was observed in all bonded specimens at both periods. CF and UB presented silver deposits predominantly restricted to the thin (0.5 μm) hybrid layer (HL) at both periods. Although no evident differences were observed in the nanoleakage pattern of UB at 7 days and 6 months, CF presented enlarged areas of silver impregnation after 6 months. SB presented accumulation of silver particles mostly within the HL at 7 days, which was intensified after 6 months. AD and OB presented massive silver accumulation within the HL and the overlying adhesive layer. No evident differences were noticed between storage periods. Silver impregnation increased for all adhesive systems from 7 days to 6 months, except for UB. © 2004 Wiley Periodicals, Inc. J Biomed Mater Res Part B: Appl Biomater 71B: 90–98, 2004