✦ LIBER ✦
Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection
✍ Scribed by M. Feil; C. Alder; G. Klink; M. König; C. Landesberger; S. Scherbaum; G. Schwinn; H. Spöhrle
- Book ID
- 106184542
- Publisher
- Springer-Verlag
- Year
- 2003
- Tongue
- English
- Weight
- 307 KB
- Volume
- 9
- Category
- Article
- ISSN
- 0946-7076
No coin nor oath required. For personal study only.