✦ LIBER ✦
Ultra-stable, high-temperature pressure sensors using silicon fusion bonding
✍ Scribed by Kurt Petersen; Joe Brown; Ted Vermeulen; Phillip Barth; Joseph Mallon Jr.; Janusz Bryzek
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 627 KB
- Volume
- 21
- Category
- Article
- ISSN
- 0924-4247
No coin nor oath required. For personal study only.
✦ Synopsis
Rezorewstlve sdlcon-based pressure sensors have been fabncated which are capable of hlghpreclslon operation at temperatures as high as 250 "C These devices are fabncated by a umque &con fusion bonding process m which resistors from one wafer are bonded to the oxldlzed surface of a second wafer The mtermedlate oxide layer electncally isolates the resistors from each other, thereby provldmg the lugh-temperature capablhty Chip performance IS excellent, especzally hneanty and the stability of offset voltage and pressure sensitivity Introduehon