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Two Cryogenic Processes Involving SF[sub 6], O[sub 2], and SiF[sub 4] for Silicon Deep Etching

✍ Scribed by Tillocher, T.; Dussart, R.; Overzet, L. J.; Mellhaoui, X.; Lefaucheux, P.; Boufnichel, M.; Ranson, P.


Book ID
125545408
Publisher
The Electrochemical Society
Year
2008
Tongue
English
Weight
540 KB
Volume
155
Category
Article
ISSN
0013-4651

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