𝔖 Bobbio Scriptorium
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Tungsten foil laminate for structural divertor applications – Basics and outlook

✍ Scribed by Jens Reiser; Michael Rieth; Bernhard Dafferner; Andreas Hoffmann


Book ID
113731859
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
955 KB
Volume
423
Category
Article
ISSN
0022-3115

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Residual stresses that developed during cooling of the tungsten-copper duplex structure were measured by the strain gauge method and compared with those by thermoelastic-plastic analyses. Good agreement was obtained for both residual stress and displacement, even when the creep effect of the copper