✦ LIBER ✦
TSV Minimization for Circuit — Partitioned 3D SoC Test Wrapper Design
✍ Scribed by Cheng, Yuan-Qing; Zhang, Lei; Han, Yin-He; Li, Xiao-Wei
- Book ID
- 118813641
- Publisher
- Springer
- Year
- 2013
- Tongue
- English
- Weight
- 772 KB
- Volume
- 28
- Category
- Article
- ISSN
- 1000-9000
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