β Scribed by Marinescu, Ioan D.
No coin nor oath required. For personal study only.
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
π SIMILAR VOLUMES
* ΒThe breadth of knowledge presented is excellent, providing a wide body of test toreference regarding abrasive processesΒ - Dr Matthew Marshall, University of Sheffield.ΒI find myself turning to MarinescuΒs Tribology when I want fundamental information onthe nature of grit-workpiece contactΒ - Dr