Spark plasma sintering of submicron-size
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R. Ritasalo; M.E. Cura; X.W. Liu; O. Söderberg; T. Ritvonen; S.-P. Hannula
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Article
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2010
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Elsevier Science
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English
⚖ 647 KB
This paper describes the microstructures and nanomechanical properties of copper consolidated of oxidized submicron-sized Cu-powder (average particle size 410 nm) by spark plasma sintering (SPS). Good compact density, small grain size (460 nm) and microhardness of 1.24 GPa were achieved at 873 K in