Transient thermal fracture and crack growth behavior in brittle media based on non-Fourier heat conduction

✍ Scribed by Chang, D.M.; Wang, B.L.

• Book ID: 118169607
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 681 KB
• Volume: 94
• Category: Article
• ISSN: 0013-7944
• DOI: 10.1016/j.engfracmech.2012.06.021