Trench IGBT failure mechanisms evolution
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A. Benmansour; S. Azzopardi; J.C. Martin; E. Woirgard
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Article
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2007
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Elsevier Science
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English
โ 567 KB
Two extreme configurations under short-circuit conditions leading to the punch through trench IGBT failure under the effect of the temperature and the gate resistance have been studied. By analyzing internal physical parameters, it was highlighted that the elevation of the temperature causes an acce