Transient liquid phase (TLP) diffusion bonding of a copper based shape memory alloy using silver as interlayer

✍ Scribed by J.M.Gómez De Salazar; F.J. Méndez; A. Ureña; J.M. Guilemany; B.G. Mellor

• Book ID: 114387913
• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 733 KB
• Volume: 37
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/s1359-6462(97)00182-6