✦ LIBER ✦
Torque and thermal cycling as methods of testing reliability of reflow-soldered chip-to-substrate joints : M. L. Allawadhi and A. K. Kakar. IEEE 11th Annual Proceedings Reliability Physics (1973). p. 77
- Book ID
- 103273543
- Publisher
- Elsevier Science
- Year
- 1973
- Tongue
- English
- Weight
- 221 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.