✦ LIBER ✦
To cut or not cut: a thermomechanical stress analysis of polyimide thin-film on ceramic structures : MICHAEL PECHT, XIN WU, KYUNG W. PAIK and S. NAVIN BHANDARKAR. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 150 (March 1995)
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 115 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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