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Tin Whisker Growth on NdSn3Powder

โœ Scribed by Hong-Chang Shi; Ai-Ping Xian


Publisher
Springer US
Year
2011
Tongue
English
Weight
544 KB
Volume
40
Category
Article
ISSN
0361-5235

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๐Ÿ“œ SIMILAR VOLUMES


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Tin whisker growth is a serious reliability concern for electronics using high-density packaging. Whisker growth behavior of tin lead eutectic solders doped with different neodymium concentration (5-0.1wt.%) was studied in present work. Results indicate that the Nd in the all of the Sn-Pb-Nd alloys