<p><p>Presenting an overview of the use of Phase Change Materials (PCMs) within buildings, this book discusses the performance of PCM-enhanced building envelopes. It reviews the most common PCMs suitable for building applications, and discusses PCM encapsulation and packaging methods. In addition to
Ti-Sb-Te Phase Change Materials: Component Optimisation, Mechanism and Applications
β Scribed by Min Zhu (auth.)
- Publisher
- Springer Singapore
- Year
- 2017
- Tongue
- English
- Leaves
- 136
- Series
- Springer Theses
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
This book introduces a novel Ti-Sb-Te alloy for high-speed and low-power phase-change memory applications, which demonstrates a phase-change mechanism that differs significantly from that of conventional Ge2Sb2Te5 and yields favorable overall performance. Systematic methods, combined with better material characteristics, are used to optimize the material components and device performance. Subsequently, a phase-change memory chip based on the optimized component is successfully fabricated using 40-nm complementary metal-oxide semiconductor technology, which offers a number of advantages in many embedded applications.
β¦ Table of Contents
Front Matter....Pages i-xvi
Introduction....Pages 1-14
Component Optimization of SbβTe for TiβSbβTe Alloy ....Pages 15-40
Component Optimization of Ti for TiβSbβTe Alloy....Pages 41-58
Crystallization Behavior of TiβSbβTe Alloy....Pages 59-74
Material and Device Performances of Optimized TiβSbβTe Alloy....Pages 75-85
Phase Change Mechanism of TiβSbβTe Alloy ....Pages 87-101
Atom Probe Tomography Study of Optimized TiβSbβTe Alloy ....Pages 103-111
TiβSbβTe-Based Phase Change Memory Chip ....Pages 113-124
β¦ Subjects
Semiconductors;Electronic Circuits and Devices;Electronics and Microelectronics, Instrumentation;Phase Transitions and Multiphase Systems
π SIMILAR VOLUMES
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