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Through-thickness characterization of copper electrodeposit

✍ Scribed by R. J. De Angelis; D. B. Knorr; H. D. Merchant

Book ID: 112812593
Publisher: Springer US
Year: 1995
Tongue: English
Weight: 680 KB
Volume: 24
Category: Article
ISSN: 0361-5235
DOI: 10.1007/bf02652963

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