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Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI

✍ Scribed by Noriki, A.; Kangwook Lee; Bea, J.; Fukushima, T.; Tanaka, T.; Koyanagi, M.


Book ID
119799650
Publisher
IEEE
Year
2012
Tongue
English
Weight
496 KB
Volume
33
Category
Article
ISSN
0741-3106

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