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Three-dimensional modeling of the heat flow into a GaAs substrate. Influence of thermal phenomena on the RF behavior of power HBTs and technological optimization

✍ Scribed by P. Souverain; T. Camps; M.S. Faleh; A. Cazarré; J. Tasselli; A. Marty; J.P. Bailbé


Book ID
108362350
Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
236 KB
Volume
38
Category
Article
ISSN
0026-2714

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