Three-dimensional microanalysis of the wire–pad contact region of integrated circuits

✍ Scribed by H. Wu; K. Takanashi; N. Ono; Zh. H. Cheng; T. Sakamoto; T. Sakou; M. Owari; Y. Nihei

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 405 KB
• Volume: 29
• Category: Article
• ISSN: 0142-2421
• DOI: 10.1002/1096-9918(200008)29:8<508::aid-sia894>3.0.co;2-i