Three-dimensional metrology of surface extracted from a cloud of measured points using a new point-to-surface assignment method: An application to PCB-mounted solder pastes

✍ Scribed by Dongwon Shin; Thomas R Kurfess

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 951 KB
• Volume: 28
• Category: Article
• ISSN: 0141-6359
• DOI: 10.1016/j.precisioneng.2003.11.002