Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures

✍ Scribed by Kerry Bernstein (auth.), Yuan Xie, Jason Cong, Sachin Sapatnekar (eds.)

• Publisher: Springer US
• Year: 2010
• Tongue: English
• Leaves: 292
• Series: Integrated Circuits and Systems
• Edition: 1
• Category: Library

✦ Synopsis

This book presents an overview of the field of 3D IC design, with an

emphasis on electronic design automation (EDA) tools and algorithms

that can enable the adoption of 3D ICs, and the architectural

implementation and potential for future 3D system design. The aim of

this book is to provide the reader with a complete understanding of:

• the promise of 3D ICs in building novel systems that enable the chip

industry to continue along the path of performance scaling,

• the state of the art in fabrication technologies for 3D integration,

• the most prominent 3D-specific EDA challenges, along with solutions

and best practices,

• the architectural benefits of using 3D technology,

• architectural-and system-level design issues, and

• the cost implications of 3D IC design.

Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.

✦ Table of Contents

Front Matter....Pages i-xii
Introduction....Pages 1-13
3D Process Technology Considerations....Pages 15-32
Thermal and Power Delivery Challenges in 3D ICs....Pages 33-61
Thermal-Aware 3D Floorplan....Pages 63-102
Thermal-Aware 3D Placement....Pages 103-144
Thermal Via Insertion and Thermally Aware Routing in 3D ICs....Pages 145-160
Three-Dimensional Microprocessor Design....Pages 161-188
Three-Dimensional Network-on-Chip Architecture....Pages 189-217
PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers....Pages 219-260
System-Level 3D IC Cost Analysis and Design Exploration....Pages 261-280
Back Matter....Pages 281-284

✦ Subjects

Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Surfaces and Interfaces, Thin Films; Engineering, general