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Three-dimensional EBSD study on the relationship between triple junctions and columnar grains in electrodeposited Co–Ni films

✍ Scribed by A. BASTOS; S. ZAEFFERER; D. RAABE


Book ID
108866464
Publisher
John Wiley and Sons
Year
2008
Tongue
English
Weight
667 KB
Volume
230
Category
Article
ISSN
0022-2720

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