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๐Ÿ“

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

โœ Scribed by Vinod Pangracious, Zied Marrakchi, Habib Mehrez (auth.)


Publisher
Springer International Publishing
Year
2015
Tongue
English
Leaves
239
Series
Lecture Notes in Electrical Engineering 350
Edition
1
Category
Library

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โœฆ Synopsis


This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

โœฆ Table of Contents


Front Matter....Pages i-xxi
An Overview of Three-Dimensional Integration and FPGAs....Pages 1-12
Three-Dimensional Integration: A More Than Moore Technology....Pages 13-41
Field Programmable Gate Arrays: An Overview....Pages 43-71
Two Dimensional FPGAs: Configuration and CAD Flow....Pages 73-94
Three-Dimensional FPGAs: Configuration and CAD Development....Pages 95-116
Three-Dimensional Tree-Based FPGA: Architecture Exploration Tools and Technologies....Pages 117-146
Three-Dimensional Thermal Modeling: Tools and Methodologies....Pages 147-168
Physical Design and Implementation of 3D Tree-Based FPGAs....Pages 169-199
Three-Dimensional FPGAs: Future Lines of Research....Pages 201-209
Back Matter....Pages 211-226

โœฆ Subjects


Circuits and Systems; Electronics and Microelectronics, Instrumentation; Processor Architectures


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