✦ LIBER ✦
Three-dimensional analysis of the interface between an Sn-8wt.%Zn-3wt.%Bi solder and a substrate by using an angle-lapping method
✍ Scribed by Nobuhiro Ishikawa; Takashi Kimura; Kenji Nishida; Takeshi Aoyagi; Kazuo Furuya; Takashi Sugizaki
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 486 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0361-5235
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