Three-dimensional (3D) visualization of reflow porosity and modeling of deformation in Pb-free solder joints

✍ Scribed by M.A. Dudek; L. Hunter; S. Kranz; J.J. Williams; S.H. Lau; N. Chawla

• Book ID: 113780411
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 842 KB
• Volume: 61
• Category: Article
• ISSN: 1044-5803
• DOI: 10.1016/j.matchar.2010.01.011