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Thin-Film Thermal Conductivity Measurement Using Microelectrothermal Test Structures and Finite-Element-Model-Based Data Analysis
โ Scribed by Stojanovic, N.; Jongsin Yun; Washington, E.B.K.; Berg, J.M.; Holtz, M.W.; Temkin, H.
- Book ID
- 111696487
- Publisher
- IEEE
- Year
- 2007
- Tongue
- English
- Weight
- 394 KB
- Volume
- 16
- Category
- Article
- ISSN
- 1057-7157
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