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ing high density 35 mm tape and the interconnection of the chips on the tape (inner lead bonding -ILB). Two alternatives of chip mounting on the substrate are also mentioned.
Chip-carriers change their course JERRY LYMAN Electronics, 114 (10 (February 1983). Conceived 10 years ago for thick film hybrid substrates, leadless packages stake claim for use on large pc boards.
Back-contact resistor network pares wire count in ECL hybrids DIETER WALTER and LOYD SEARLE Electronics, 173 (19 May 1982) Thin-film tantalum-nitride resistor chip eliminates four interior wire bonds with a common back conta.ct.
Thin-film systems for hybrid circuits -produced by plasmatron atomizers S. SCHILLER, U. HEISIG, K. GOEDICKE, H. BILZ, J. HENNEBERGER and G. PFEIL Nachrichtentechnik Elektronik 32 (tt30, 105 (1982) (in German) Manufacture and properties of a thin-film system for hybrid circuits being free from noble metals are described. It consists of a precision transmission exhibits a sudden drop and subsequently remains at a detectable level. This laser-induced absorption is inconsistent with the presence of ordinary molten silicon but suggests an 9 electronic structural-change from amorphous to crystalline state.
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