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Thin bodyline measurement of adhesively bonded metallic aircraft structures using an ultrasonic anlyzer

✍ Scribed by Wongwiwat, W.; Rizzo, R.; Rigney, D.

Book ID: 123017775
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 172 KB
Volume: 25
Category: Article
ISSN: 0963-8695
DOI: 10.1016/0963-8695(92)90525-L

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48357 Thin bodyline measurement of adhesively bonded metallic aircraft structures using an ultrasonic analyzer: Wongwiwat, W.; Rizzo, R.; Rigney, D. Review of progress in quantitative nondestructive evaluation, La Jolla, California (United States), 15–20 Jul. 1990. Vol. 10B, pp. 1375–1382. Edited by D.O. Thompson and D.E. Chimenti. Plenum Press (1991). ISBN 0-306-43903-4.

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