Thickness optimization of composite plates by Box’s complex method considering the process and material parameters in compression molding of SMC

✍ Scribed by Moo Sun Kim; Woo Il Lee; Woo Suck Han; Alain Vautrin; Chung Hae Park

• Book ID: 116378663
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 797 KB
• Volume: 40
• Category: Article
• ISSN: 1359-835X
• DOI: 10.1016/j.compositesa.2009.05.003