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Thick-film acoustic emission sensors for use in structurally integrated condition- monitoring applications

✍ Scribed by Pickwell, A.J.; Dorey, R.A.; Mba, D.

Book ID: 119823997
Publisher: IEEE
Year: 2011
Tongue: English
Weight: 793 KB
Volume: 58
Category: Article
ISSN: 0885-3010
DOI: 10.1109/tuffc.2011.2043

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