## Abstract Eight commercial semiconductor grade epoxy compounds that are used to encapsulate 1C (integrated circuit) devices have been evaluated for their ability to minimize the development of thermal stresses which can cause failure during device temperature cycling. Thermal expansion, dynamic m
Thermomechanical assessment of molding compounds
β Scribed by Selig, O.; Alpern, P.; Muller, K.; Tilgner, R.
- Book ID
- 114560349
- Publisher
- IEEE
- Year
- 1992
- Tongue
- English
- Weight
- 560 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0148-6411
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Lach et al./Deformation Behavior of Nitrogen-Alloyed Austenitic Steels at High nounced with increasing hardness. The difference in strength between specimens 3 and 4 amounts to 200 MPa in Figure 4 and 500 MPa in Figure 5. A metallographic study on quasistatically compressed specimens shows localize
## Abstract Bonding and bolting strengths of a sheet molding compound (SMCβR30) are investigated. Epoxy adhesives are found to give good bonding strength. Surface pretreatment does not affect bond strength. Artificial weathering has practically no effect upon bond strength. Bolting strength depends