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Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer

✍ Scribed by Choi, Hyung Jip

Book ID: 125350280
Publisher: Springer Vienna
Year: 2014
Tongue: English
Weight: 714 KB
Volume: 225
Category: Article
ISSN: 0001-5970
DOI: 10.1007/s00707-013-1080-2

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