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Thermoelastic damping of the in-plane vibration of thin silicon rings

โœ Scribed by S.J. Wong; C.H.J. Fox; S. McWilliam


Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
318 KB
Volume
293
Category
Article
ISSN
0022-460X

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โœฆ Synopsis


This paper considers thermoelastic damping of the in-plane vibration of rings. The work was motivated by the need to gain improved understanding of energy-dissipation effects in silicon MEMS resonators, for which a high Q-factor is often a key design objective. The presented analysis is based on Zener's classical work on the modelling of thermoelastic loss in uniform beams, and on a recent refinement of Zener's analysis by Lifshitz and Roukes. A review of Zener's and Lifshitz and Roukes' analysis is given. The paper then extends the above work by applying the thermoelastic models to the in-plane vibration of uniform rings of rectangular cross-section. Using both approaches, numerical predictions of modal Q-factors are developed and compared. The relationships between ring geometry, scale and Q-factor are explored and the ability to choose resonator dimensions to control Q-factor due to thermoelastic loss is illustrated.


๐Ÿ“œ SIMILAR VOLUMES


THE IN-PLANE VIBRATION OF THIN RINGS WIT
โœ C.H.J. Fox; R.S. Hwang; S. McWilliam ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 204 KB

Geometric profile variations always exist in nominally circular rings due to limitations in the manufacturing processes. Such profile variations are known to lead to frequency splitting between pairs of modes which are degenerate in a perfect ring. In this paper, the effects of circumferential profi

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This paper presents a methodology for the analysis of the free, in-plane, vibration of thin rings with profile variations in the circumferential direction. The methodology is suitable for any thin ring which is bounded by closed curves which are single valued functions of circumferential position. T