Thermodynamic–kinetic simulation of solidification in binary fcc copper alloys with calculation of thermophysical properties

✍ Scribed by J. Miettinen

• Book ID: 117626656
• Publisher: Elsevier Science
• Year: 2001
• Tongue: English
• Weight: 245 KB
• Volume: 22
• Category: Article
• ISSN: 0927-0256
• DOI: 10.1016/s0927-0256(01)00239-7