✦ LIBER ✦
Thermocompression bonding of external package leads on integrated circuit substrates : V. P. Bolcar, IEEE Trans. ED-15, September (1968), p. 651
- Publisher
- Elsevier Science
- Year
- 1970
- Tongue
- English
- Weight
- 100 KB
- Volume
- 9
- Category
- Article
- ISSN
- 0026-2714
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