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Thermoanalytical studies of copper-containing additives

✍ Scribed by N. G. Kozhaeva; I. I. Zanozina; D. E. Diskina; V. A. Kol'tsova


Publisher
Springer US
Year
1987
Tongue
English
Weight
206 KB
Volume
23
Category
Article
ISSN
0009-3092

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## Abstract It was expected that elemental copper or zinc introduced into polycaproamide would interact with amide groups of the polymer and that the materials would be characterized by semiconductor properties. To prove this theory, resistivity at several temperatures was determined and thermal ac