Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films

✍ Scribed by S. Strehle; S. Menzel; H. Wendrock; J. Acker; T. Gemming; K. Wetzig

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 443 KB
• Volume: 76
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2004.07.055